Sunstar Group Chemical Division adheres to the concept of environmental friendly, safe use, advanced technology and high quality product design, and is committed to research and development and sales of the following agents and sealants applied in the automotive, motorcycle, electronics, construction and other industrial fields, and provides the solution for customers.Sunstar has established a perfect service network in many regions around the world (North America, Europe, Asia, etc.) to provide product technology and services to customers in the global industrial field.Sunstar Group invested and established shengshida (Guangzhou) Chemical Co., Ltd. in Guangzhou, China in 1997. Its chemical division focuses on R & D, production and sales of automotive, electronic and construction indus...
Huitian New Material Co., Ltd. is a high-tech enterprise group specializing in the research and development and production of adhesives and new materials, with the stock code of 300041. It has set up industrial bases and research and development centers in Shanghai, Guangdong, Jiangsu and Hubei respectively, and holds the authoritative academic core journal 'Bonding' in the industry. Company has passed ISO9001, ISO/TS16949 quality management system certification, ISO14001 international environmental management system certification, product through the SGS, TUV, JET, CQC, GL, JG, UL, DIN, NSF, FDA, LFGB, API certification, is currently China's new energy, electronic, automotive, industrial, packaging, environmental protection, construction, high iron industry one of the greatest...
Hefei hengshuo semiconductor co., LTD is committed to the design, development, production and sales of advanced semiconductor flash memory chips and embedded flash memory. 25years experience in memory technology The core team is from Silicon Valley of the United States and China's top memory enterprises. With many years of experience in flash memory chip management, manufacturing, technology, design, marketing and sales, the company has more than 60% R&D personnel.Flash BU Forming strategic cooperation with a number of wafer production and packaging plants to jointly develop NOR flash memory, EEPROM, SLC/SPI NAND and other new memory. CIM AI /MCU BU Collaborated with University of Science and Technology of China and University of Academy of Sc...
BOARD TO BOARD, in particular, is recognized for its high reliability with various positions and height grade from 0.50MM PITCH to 2.54MM PITCH. Just with BOARD TO BOARD CONNECTOR especially, POCONS owns two patents for new device and makes application for three patents. POCONS is going to share such a technological trust with the customers.To make a second leap in 2006, POCONS moved to Suwon industrial complex in September and prepared a new base of a growth engine to innovate technologies regarding molding, stamping, total system of assembly and processes for assembling handsets. This is POCONS promise to the customers that the company will make a second leap based on a new concept, new technologies and new development system. On such a foundation, POCONS will swiftly cope with the ...